6318045-8 datasheet

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О ДАТАШИТЕ

• Маркировка
  6318045-8
• Производитель
  TE Connectivity
• Описание
  TE Connectivity 6318045-8 Applies To: Printed Circuit Board Board-to-board Stack Height (mm [in]): 4.00 [0.157] Centerline (mm [in]): 0.60 [0.024] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Grounding Contact: With Industry Application: Board-to-Board (Personal Systems/Computers) Keyed: Yes Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Locating Post(s): With Number Of Positions: 100 Packaging Method: Tape & Reel Pcb Mounting Orientation: Vertical Preloaded: Yes Product Type: Connector Region: Asia/Pacific Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Vacuum Cover: With
• Количество страниц
  2 шт.
• Форматы файла
  HTML, PDF

  (Для просмотра требуется Adobe Acrobat Reader)

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